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Automatic Deep Access Wire Bonder SA-DAWB-6000W
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SKU:
SA-DAWB-6000W
| Bonding Accuracy | Ā±3 Ī¼m@3sigma |
|---|---|
| Bonding Area | X-axis: 305 mm, Y-axis: 457 mm, rotation range: Ā±220Ā° |
| Ultrasonic | 0~4 W precise control with stepped flexible energy output |
| Loop Control | Fully programmable |
| Cavity Depth | 16mm(max.) |
| Bonding Force | 0~220g |
| Capillary Length | 19mm/25mm |
| Bonding Wire Type | Gold wire(18~75Ī¼m), aluminum wire (18~75āÆĪ¼m), gold ribbon (12.7Ć50āÆĪ¼m ~ 25.4Ć300āÆĪ¼m), partial alloy wires |
| Bonding Speed | ā„5wires/s |
| Operating System | Windows |
| Weight | 1.2T |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ā„0.35MPa |
| Size(LĆWĆH) | 1500mmĆ1000mmĆ1700mm |
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Femtosecond Laser 3D Micro-Nano Processing Equipment for Hard-and-Brittle Materials SA-FSD-500
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SKU:
SA-FSD-500
| Processing Position | Patterned material modification and waveguide structures |
|---|---|
| Wavelength | 1030nm, 515nm |
| Objective Lens | 50Ć/20Ć |
| Illumination | Reflection & Transmission |
| Functional Configuration | External energy adjustment, 2D motorized slit |
| Optional | Spatial Light Modulator (SLM), auto-focus tracking |
| Adjustment Stage | Manual |
| Travel Range of Motion Stage | 200āÆmm Ć 200āÆmm |
| Fixture & Workstation | Large-area transparent adsorption stage |
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Femtosecond Laser Micro-Nano Automatic Processing Equipment for Fiber Bragg Gratings SA-FSD-1000IR
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SKU:
SA-FSD-1000IR
| Processing Position | Mass production of typical fiber gratings Kilometer-length fiber processing |
|---|---|
| Wavelength | 515nm |
| Objective Lens | 60Ć |
| Illumination | Transmission |
| Functional Configuration | External energy adjustment |
| Optional | Spatial Light Modulator (SLM), 2D motorized slit |
| Adjustment Stage | Motorized |
| Travel Range of Motion Stage | 100āÆmm Ć 100āÆmm |
| Fixture & Workstation | Automatic fixture for fiber grating fabrication |
| Automatic fiber winding | Full-function automatic fiber winding |
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Fully automated, high-performance PECVD equipment SA-EPEE i200
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SKU:
SA-EPEE i200
| Wafer Size | 6″, 8″ |
|---|---|
| Substrate Type | TiW, Si, SiC, W, TiN, Ti |
| Standard Configuration | SMIFĆ3+EFEMĆ1+LLĆ2+TMĆ1+PMĆ3 |
| Wafer Station | Twins chamber, 2 pcs/chamber, max 6pcs for 3 chambers |
| Automation | Open cassette/SMIF |
| Process | SiO2/SiNx/TEOS/BPSG |
| Deposit Materials | SiO2, SiNx, SiON, TEOS SiO2, BPSG |
| Uniformity | WIW ā¤3.0%ćWTWā¤3.0%ćRTRā¤3.0% |
| Gas Configuration | TEOS/TEPO/TEB/O2/SiH4/NH3/N2O/He/N2/NF3/Ar(RPS) |
| Cooling Module | EFFM cooling buffer |
| Foot print | 2100Ć3360(7.0m2) |
| WPH(relative) | 1.20 |
| CoC(relative) | 0.83 |
| CoO(relative) | 0.75 |
| Clean Mode | RPS clean,>2Ī¼m/min |
| Size(LĆWĆH) | 2100mmĆ3360mmĆ2600mm |
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Multifunctional Manual Wire Bonder SA-MMWB-450PB
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SKU:
SA-MMWB-450PB
| Bonding Wire Type | Au(15~75Ī¼m),Pt(18~25Ī¼m), Cu(18~50Ī¼m),Ag(18~50Ī¼m) |
|---|---|
| Cavity Depth | 15mm(max.) |
| Capillary Length | 16mm/19mm |
| Spool Diameter | 1/2inch(standard), 2inches(optional) |
| Bonding Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200ā |
| Bond Head Z Range | 18mm |
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Weight | 70kg(NW.), 47kg(GW.) |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power Consumption | ā¤500W |
| Size(LĆWĆH) | 640mmĆ620mmĆ450mm |
Multifunctional Manual Wire Bonder SA-MMWB-450PW
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SKU:
SA-MMWB-450PW
| Bonding Wire Type | Al(18~100Ī¼m),Au(15~75Ī¼m), Gold Ribbon(12.7 Ć 50Ī¼m~25.4 Ć 300Ī¼m),specific alloy wire |
|---|---|
| Cavity Depth | 21mm(max.) |
| Capillary Length | 19mm/25mm |
| Spool Diameter | 1/2inch(standard), 2inches(optional) |
| Bonding Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200ā |
| Bond Head Z Range | 18mm |
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Weight | 47kg(GW.), 70kg(NW.) |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power Consumption | ā¤500W |
| Size(LĆWĆH) | 640mmĆ620mmĆ450mm |
Multifunctional Manual Wire Bonder SA-MMWB-450B
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SKU:
SA-MMWB-450B
| Bonding Wire Type | Au(15~75Ī¼m),Pt(18~25Ī¼m),Ag(18~50Ī¼m) |
|---|---|
| Cavity Depth | 12mm(max.) |
| Capillary Length | 16mm/19mm |
| Spool Diameter | 1/2inch(standard), 2inches(optional) |
| Bonding Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200ā |
| Bond Head Z Range | 18mm |
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Weight | 47kg(GW.), 70kg(NW.) |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power Consumption | ā¤500W |
| Size(LĆWĆH) | 640mmĆ620mmĆ450mm |
Automatic Ball Wire Bonder SA-BWB-6000PC
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SKU:
SA-BWB-6000PC
| Bonding Accuracy | Ā±3 Ī¼m@3sigma |
|---|---|
| Bonding Stroke | X=60mm,Y=70mm |
| Length of Wire Bonding | ā¤7mm |
| Loop Height Accuracy | Ā±25.4Ī¼m |
| Loop Types | Q-loop / SQ-loop / BGA-TWS |
| Spool Diameter | 50mm(2inches) |
| Bonding Force | 0~360g |
| Bonding Wire Type | Gold, Copper, CuPd, Ag, Alloy wire(18~50Ī¼m) |
| Bonding Speed | 45ms(2mm wire length) |
| Operating System | Windows |
| Optical System | Option between Ć2~Ć4 and Ć1.6~Ć3.6 times, both with programmable focus |
| Weight | 650Kg |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power | 2KW |
| Compressed Air Requirement | ā„0.35MPa |
| Size(LĆWĆH) | 1000mmĆ1300mmĆ1700mm |
Hot Products
Hot
Multifunctional Manual Wire Bonder SA-MMWB-450PB
In stock
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SKU:
SA-MMWB-450PB
| Bonding Wire Type | Au(15~75Ī¼m),Pt(18~25Ī¼m), Cu(18~50Ī¼m),Ag(18~50Ī¼m) |
|---|---|
| Cavity Depth | 15mm(max.) |
| Capillary Length | 16mm/19mm |
| Spool Diameter | 1/2inch(standard), 2inches(optional) |
| Bonding Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200ā |
| Bond Head Z Range | 18mm |
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Weight | 70kg(NW.), 47kg(GW.) |
| Input Voltage | 220VĀ±10%@50~60Hz |
| Power Consumption | ā¤500W |
| Size(LĆWĆH) | 640mmĆ620mmĆ450mm |
Fully Automatic Photonics Wafer Test System SA-WIT-220AL
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SKU:
SA-WIT-220AL
| Wafer Size | 2″~12″ |
|---|---|
| Loading Method | Automatic |
| Loading Type | Cassette/FOUP |
| Testing Capacity | 25~50 pcs/run |
| Wafer-ID | OCR-based automatic Wafer-ID recognition with Wafer Map generation |
| Auxiliary Chuck | Enables automatic probe cleaning, RF calibration, FA calibration, PD power/polarization calibration |
| Single-Probe Marking | Yes |
| Self-Cleaning | Yes (for wafer, Chuck, probes, FA) |
| Real-Time Height Sensing | Yes |
| Chuck Height Calibration | Yes |
| Chuck Positioning Accuracy | Ā±2Āµm |
| Temperature Range | -40~125ā |
Vertical Furnace SA-Flouris X201H/P
In stock
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SKU:
SA-Flouris X201H/P
| Wafer Size | 6″, 8″ |
|---|---|
| Process | FOX/STI Anneal/Pad-Oxide/Gate Oxide/BPSG Reflow/Final Alloy/Cu Anneal/N2 Anneal/Polyimide Cure |
| Compatible Materials | Si, SiC, GaN |
| Teamperature Control Accuracy | ā¤Ā±1ā |
| Flat Zone Length | 860mm |
| Batch Size | 150/125 |
| SMIF/Open Cassette/OHT | Option |
| N2 Load Lock | Option |
| AGC | Option |
| Particle Control | ā¤20@0.16Ī¼m |
| Uniformity(WIW/WTW/LTL) | ā¤2%/1.5%/1.5% |
| Metal Contamination (ICP-MS/TXRF) | 5E10 |
| Loccalization Progress | Continuous improvement |
| Size(LĆWĆH) | 4420mmĆ900mmĆ3302mm, 4093mmĆ900mmĆ3302mm |
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